| 摘要 |
<p>Method for encapsulating a chip (10) on a carrier (12) whereby the chip (10) is positioned on the carrier (12), a dam (16a, 16b) is formed on the carrier (12) around the chip (10), encapsulating material (18) is poured into the space within the dam (16a, 16b), and the obtained encapsulated structure is cured. In a first separate step on the carrier only the dam (16a, 16b) is formed from a thermohardening material at a relatively high temperature and is cured at least partly and in a succeeding second step the space within the dam is filled with the same thermohardening material at a relatively low temperature.</p> |
