Radiant surface mount semiconductor device e.g. IR-emitting diode

摘要

The device is fitted with a one-piece sleeve (1) of e.g. epoxy resin with a radiation-emitting surface (12) and a base (13) at opposite ends. Another surface (14) for contact with a circuit board (21) is substantially at right angles to the base and in the same plane as the solder surfaces (e.g. 16) of connection tags (7,8) protruding from the base. This plane is either parallel or inclined at an acute angle to the optical axis (24) of the semiconductor device. Each connection tag has an S-bend (28) and extends as far as a conductive track (29) on the circuit board.