| 摘要 |
<p>Novel cyclopentylene compounds represented by general formula (I), which are suitable for use as a sealing material for electronic devices, have a high Tg, a low hygroscopicity, and high adhesive properties, and are highly flowable; and cyclopentenyl compounds represented by general formula (III) which are intermediates for the cyclopentylene compounds. In the formulae, m is 0 or larger, and Ar?1 and Ar2¿ each represents a phenol residue, a naphthol residue, or a fluorene derivative residue and contains a hydroxy or glycidyloxy group. A resin composition/molding material containing any of the cyclopentylene compounds; and an electronic device obtained by sealing the element with the same.</p> |
