| 摘要 |
An improved apparatus for cleansing a semiconductor wafer which is capable of separating an inner tub into an upper and lower portion, for thus adjustably forming the inner tub, so that it is possible to fold the upper portion of the inner tub when cleansing the wafer, for thus reducing the cleansing space, whereby it is possible to reduce the amount of the cleansing liquid and increasing the cleansing effect. The apparatus includes an outer tub having a supply tube for supplying a cleansing liquid and for discharging the cleansing liquid, a lower inner tub disposed inside the outer tub, an upper lower tub disposed above the lower inner tub, which upper lower tub is adjustable in cooperation with a first hinge member, a driving member disposed in cooperation with a second member for opening and closing the upper inner tub, a control member for controlling the driving member, a baffle plate for distributing the cleansing liquid supplied through a supply tube, and a pump disposed in the supply tube for supplying the cleansing liquid into the inner tub. |
