| 摘要 |
<p>The present invention pertains to semiconductor chips and wafers presenting on at least one face a protective layer applied according to a flame or plasma projection method. The protective layer is mainly ceramic. Between the protective layer and the chip or wafer surface, there can be an intermediate layer made of a non-electroconductive and moisture-proof material. The intermediate layer has an adhesive function and improves the chip or wafer surface protection against chemical and mechanical degradations and makes the unauthorized detection of circuit systems difficult.</p> |
