发明名称 HERMETICALLY SEALED ELECTRICAL FEEDTHROUGH FOR USE WITH IMPLANTABLE ELECTRONIC DEVICES
摘要 A thin hermetically sealed electrical feedthrough suitable for implantation within living tissue permits electrical connection between electronic circuits sealed within an hermetically sealed case and electrical terminals or contacts on the outside of the case. The hermetically sealed case is made by hermetically bonding a cover to an insulating layer. The hermetically sealed electrical feedthrough is made by depositing a conductive trace on the insulating layer and then depositing another insulating layer thereover, so that the conductive trace is hermetically encapsulated within the insulating layers. At least two spaced-apart openings are formed in the insulating layers before bonding the cover thereto, exposing the conductive trace. Additional conductive material is then inserted within each of the openings or holes so as to form conductive vias that make electrical contact with the conductive trace. The cover is then hermetically sealed to the insulating layer so that at least one conductive via resides inside of an hermetically sealed cavity formed under the cover, and the other conductive via resides outside of the hermetically sealed cavity. An electrical feedthrough is thus formed through the respective conductive vias and conductive trace so that electrical contact may be made between the outside and inside of the hermetically sealed cavity.
申请公布号 EP0844899(A1) 申请公布日期 1998.06.03
申请号 EP19960928169 申请日期 1996.08.14
申请人 ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH 发明人 SCHULMAN, JOSEPH, H.;CANFIELD, LYLE, DEAN
分类号 A61N1/375;H01L23/057;H05K1/03;H05K3/28;H05K3/40;H05K5/00;(IPC1-7):A61N1/375 主分类号 A61N1/375
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