Laminate

摘要

The object of the invention is to solve a problem of bending of laminate caused by hardening contraction of epoxy resin that has been a subject in laminate used conventional epoxy resinous composition in laminate of two or more than two layers used for electric and electronic parts, and to provide a novel laminate obtaining excellent adhesive property and heat resistant property, and exhibiting no bending. The inventive laminate achieving the above object comprises laminating at least the following two components (a) and (b): (a) resin composition comprising thermosetting resin composed of imide carbonate synthesized by reacting cyanate resin and compound which containing at least 1 or more than 1 phenolic hydroxyl, and epoxy resin (b) heat resistant resin obtaining glass transition temperature of 150 DEG C. or more than 150 DEG C. and thermal expansion coefficient of 0.4 to 3.8x10-5 cm/cm/ DEG C. at the temperature of 20 DEG (ordinary temperature) to 150 DEG C. The inventive thermosetting resin composition has been consummated by converting cyanate resin into imide carbonate under the presence of epoxy resin.