| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the generation of an electrical short-circuit between bonding pads and to make sure an electrical insulation between the bonding pads by a method wherein the surface roughness of the regions, whereon the bonding pads are formed, of an uppermost organic resin insulating layer is set ion a specified extent and the peripheral regions of the pads are made to cover with a resin film. SOLUTION: The upper surface, on which bonding pads 7 are formed, of an uppermost organic resin insulating layer 2a is formed into a roughened surface of 0.05μm<=Ra<=5μm in the mean roughness of the roughnesses in and on the center line of the upper surface. The peripheral regions of the pads 7 are made to cover with a resin film 10. Owing to this, the bonding strength of the layer 2a to the pads 7 becomes a strong one and it becomes possible to connect an electronic component 8 with the pads 7 and a semiconductor element and the like with thin film wiring conductors 3 reliably and electrically. Moreover, when a corrosion-resistant metal film 9 is made to adhere to the surfaces of the pads 7, the metal film 9 can be prevented from being adhered to the surface of the film 2a and the pads 7 are prevented from being short- circuited electrically.</p> |
