| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer processor for preventing a slip and rotating at a high speed to realize a high growing speed by making a contact area of an outer periphery of the wafer with a wafer placing part. SOLUTION: The wafer processor places a wafer 6 on a suscepter 105, rotates it around a rotary shaft, and heats it by a heat source 8 such as a heater or a lamp to process it. The suscepter 105 has a wafer placing part 110 for placing and holding the wafer 6. The part 110 has a step 111 extended from an outer edge of a through hole 112 formed to bring heat of the source into contact with the wafer 6. The edge 111a of the step 111 is formed of a plurality of circular arcs 115, 116 having different diameters so that any one 115 of the arcs 115, 116 has substantially equal diameter to that of the wafer 6. Any one 115 of the arcs 115, 116 has substantially equal diameter to that of the wafer 6 and its rotating center 114 of the arc 115 is deviated from an axial center O of the rotary shaft.</p> |
