发明名称 SEALING STRUCTURE FOR SEMICONDUCTOR PACKAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain specific sealing strength at the time of re-operation and prevent the occurrence of variation in sealing strength by the elimination of sealing-temperature change due to the number of times that firm pressing under heat is carried out, by controlling the temperature of a trowel receiver which is underneath an embossed tape. SOLUTION: Based on temperature data from a temperature sensor 1 such as a thermister, a controller 20 sets the temperature of a cartridge heater 2 and controls the temperature of a sealing trowel 3. Based on temperature data input from a temperature sensor 8, a controller 10 controls the temperature of a cartridge heater 7 so as to keep the temperature of a sealing part at a specific value. In this condition, a semiconductor product is inserted into the pocket of an embossed tape 5, thereafter adhesive top tape 4 is placed on it and it is sealed by firmly pressing a sealing trowel 3, having the specific temperature, to it from above under heat. At the time, by also controlling the temperature of a trowel receiver 6, the temperature of the sealing bowel 3 can be kept constant without being decreased.
申请公布号 JPH10147303(A) 申请公布日期 1998.06.02
申请号 JP19960316900 申请日期 1996.11.14
申请人 NITTETSU SEMICONDUCTOR KK 发明人 KOYAMA TOSHIO
分类号 B65B7/28;B65B51/10 主分类号 B65B7/28
代理机构 代理人
主权项
地址
您可能感兴趣的专利