| 摘要 |
PROBLEM TO BE SOLVED: To easily flatten a surface to be polished of a wafer by preventing an uneven surface from being formed even when the wafer is polished with a head for chucking a wafer which is provided with an opening for allowing medium to blow over the wafer chucking surface. SOLUTION: A wafer polishing device for polishing a wafer 60 is provided with a head 50 which chucks the wafer 60 during polishing and is provided with a top plate 52 mounted on a head body 51 which is supported by a shaft 56. An opening 53 for allowing medium to pass is formed along the perimeter of a flat wafer chucking surface 52a of the top plate 52. The opening 53 leads to a passage 55 for medium which is formed inside the head 50. A guide ring 54 is also provided on the head 50 along the perimeter of the opening 53. The guide ring 54 forms a space 53a leading to the opening 53 and is provided with a prominence 54a toward the inside for facilitating the flow of the medium between the chucking surface 52a and the wafer 60. |
