| 摘要 |
PROBLEM TO BE SOLVED: To increase the package coefficient of electronic component by a method wherein the compensation angel of an electronic component having a polarity mark is corrected by turning at the angle specified by the side numbers of the electronic component for correcting the angle of the electronic component more precisely thereby enabling the electronic component to be fitted to a substrate in the correct direction. SOLUTION: The shape of electronic component 13 is discriminated according to the picked-up picture image so as to detect the compensation angle of the electronic parts 13. Next, a polarity mark 12 is detected and if the polarity mark 12 is used, the direction of the electronic component 13 is corrected by turning the electronic component 13 at the angle specified by the side numbers of the electronic component 13. Through these procedures, the angle correction of the electronic component 13 can be performed more precisely by the compensation by turning for directional correction in addition to the conventional angle compensation thereby enabling the electronic parts 13 to be fitted to the substrate in the correct direction. Futhermore, the quality and precision of the substrate after fitting the electronic component 13 can be improved due to the precise fitting of the electronic component 13 to the substrate. Besides, the disposal factor of the electronic component 13 can be reduced, thereby enabling the package factor to be increased. |
