| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve a connection reliability to solder bumps as external terminals and manufacturing productivity. SOLUTION: Insulating tape 3 having a wiring pattern 4 provided thereon is bonded to a lead frame, semiconductor elements 1 are mounted thereon, and then circuit formation surfaces and side faces of the elements 1 are sealed with sealing resin 7. After formation of such individual semiconductor devices, next, the lead frame is divided into individual metal plates 6 to obtain individual semiconductor devices. Since a plurality of semiconductor devices can be simultaneously manufactured in this way, its productivity can be improved, flatness of the tape 3 can be improved, and connecting reliability to solder bumps 8 can be improved. |
