发明名称 MEMORY MODULE AND PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To enable a specific data to be written in a non-volatile memory after packaging the non-volatile memory having writing-in control terminals on a printed board. SOLUTION: An EEPROM 2, a pull up resistor 3, a plurality of memory devices 4 and another plurality of chip capacitors are packaged on a memory module board 1 in this memory module for respective applications of electronic equipments.system etc., such as personal computers.workstations etc. As for the memory module board 1, the printed board in the standard specification adaptive for JEDEC unified standard is adopted on whose main surface a mounting pad of writing-in control terminals 6 of the EEPROM 2 are connected, an exclusive writing-in pad 8 connected to a power supply Vcc through the intermediary of the pull up resistor 3 is provided so that the voltage level this pad 8 may be externally and electrically controlled in the case of writing-in step.
申请公布号 JPH10150143(A) 申请公布日期 1998.06.02
申请号 JP19960307790 申请日期 1996.11.19
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 TOKIDA KENSUKE;TSUKUI SEIICHIRO;SATO TOMOHIKO
分类号 H05K1/11;H01L25/10;H01L25/18;H05K1/02;H05K1/18;(IPC1-7):H01L25/10 主分类号 H05K1/11
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