| 摘要 |
PROBLEM TO BE SOLVED: To mount a heat slab without using thermosetting adhesive agent with requires a very careful handling when it is stored or manufactured by a method wherein a conductive layer is formed on the one side of a circuit board receding form the circumference edge of an opening by a prescribed length, and the heat slab is joined to the conductor layer with solder. SOLUTION: A laminate composed of circuit boards 20a and 20b is arranged so as to make a conductor 26c serve as an upside, solder 54 is applied onto the the conductor 26c, and a heat slab 30 is mounted on the circuit board 20b. Thereafter, the circuit boards 20a and 20b and the heat slab 30 re heated up to the melting point of solder 54. At this point, the heat slab 30 is moved on the solder 54 as to be uniformly aligned with the conductor 26c and then fixed. By this setup, adhesive agent, which is required to be refrigerated for storage so as not to deteriorating in quality and needs strict control of pressure and temperature when it is manufactured, can be dispensed with, so that a semiconductor package of this constitution can be easily handled and improved in workability. |
