发明名称 METHOD OF MANUFACTURING MULTILAYER PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To make consistent of the shock resistance, thermal resistance, electric insulation reliability, etc., thereby enabling the workability of a fine blind via hole using alkali solution to be enhanced by a method wherein an interlayer insulating layer is mainly composed of a specific (meta) acrylic polymer and a specific fine particle bridge elastic polymer. SOLUTION: A copper plated insulating sheet 3 is manufactured by coating the roughened surface of copper foil 1 with a resin composition 2 for insulating material blended with an alkali soluble acrylic polymer and/or metacrylic polymer having carboxyl radical, polymer compound having exceeding one each of C=C unsaturated double coupling, fine particle bridge elastic polymer in the mean particle diameter not exceeding 5μm containing carboxyl radical as well as a polymerization initiator initiating the C=C unsaturated double coupling polymerization. Through these procedures, a material combining shock resistance with thermal resistance, flame retardation and insulation reliability hardly feasible in the prior art acrylic resin can be manufactured, thereby enabling an excellent multilayer printed-wiring board to be manufactured.
申请公布号 JPH10150277(A) 申请公布日期 1998.06.02
申请号 JP19960321191 申请日期 1996.11.18
申请人 TOAGOSEI CO LTD 发明人 HARUTA YOICHI;HIRAOKA HIDEKI;MATSUMOTO TAKEYA;HIBINO HIROSHI;KIMURA KAORU
分类号 C08L33/04;C08F265/00;C08F290/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 C08L33/04
代理机构 代理人
主权项
地址