| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer treating device adaptable to a big-size plate without upsizing its height. SOLUTION: A treating liquid bath 42 for immersing multiple wafers W supported in parallel by a wafer supporter 6 is placed in the lower part of a chamber 41 and a drying chamber 43 for drying the wafers W which are drawn out of the treating liquid bath 42 with the supporting means 6 is placed in the upper part of the chamber 41. An opening 44 for putting the wafer supporter 6 in and out of the drying chamber 43 is placed on the side of the chamber 41. A shutter mechanism 45 is provided on the opening 44. A supporter transporting mechanism is provided outside the chamber 41 for putting the supporter 6 in and out of the chamber 41 through the opening 44. A supporter up-and-down mechanism 46 is provided inside the chamber 41 for moving up and down the supporter 6 received from the supporter transporting mechanism between the treating liquid bath 42 and the drying chamber 43. |
