发明名称 RESIN SEALING MATERIAL AND SEMICONDUCTOR DEVICE USING THE MATERIAL AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To arrest the effect of electromagnetic waves thereby eliminating further electromagnetic shielding using a shielding plate by a method wherein a resin sealed body resin sealing semiconductor pellets is formed of a resin sealing material made of sealing resin blended with solid matter having electromagnetic shielding effect. SOLUTION: A hybrid IC 28 is provided with a wiring substrate 10, semiconductor pellets bonded onto the wiring substrate 10 by bonding layers 21, power transistors 23, passive elements 24 as well as a resin sealed body 27 resin sealing these elements. This resin sealed body 27 is formed of a resin sealing material made of sealing resin 41 blended with ferrite particles 42. Through these procedures, even if the hybrid IC 28 is irradiated with electric waves, since the electric waves can be electromagnetically shielded by ferrite particles 42 contained in the resin sealed body 27, the malfunction of the hybrid IC 28 can be avoided.
申请公布号 JPH10150290(A) 申请公布日期 1998.06.02
申请号 JP19960323480 申请日期 1996.11.19
申请人 HITACHI LTD 发明人 MAEJIMA NOBUYOSHI;KOBAYASHI KUNIO;ENDO TSUNEO
分类号 C08K3/22;H01L21/56;H01L23/29;H01L23/31;H05K1/02;H05K3/28;H05K9/00 主分类号 C08K3/22
代理机构 代理人
主权项
地址