Flip-chip die attachment for a high temperature die to substrate bond

摘要

A method and structure is given for flip-chip mounting an integrated circuit on a substrate. An embodiment of the present invention is a GaAs die flip-chip 14 mounted to a silicon semiconductor 10 which has additional processing circuitry. The flip-chip bond uses an alloy metal film, preferably a thin film of AuGe 38, 40. The invention gives a high temperature bond which is suitable for subsequent high temperature processes to be performed on the flip-chip mounted combination. The bond may also include a diffusion barrier 36 which provides a short circuit free LED contact. A preferred embodiment introduces a microchip chemical sensor by integrating a GaAs LED 14 with a polyimide waveguide 56 and a silicon photosensor 16 on the same chip.