A fabrication process includes a step of providing a substrate to be fabricated. A multi-layer antireflective layer is then formed on the substrate. A patterned resist having a thickness less than 850 nanometers is formed on the multi-layer antireflective layer and the substrate is fabricated using the patterned resist as a mask.
申请公布号
US5759746(A)
申请公布日期
1998.06.02
申请号
US19960653426
申请日期
1996.05.24
申请人
KABUSHIKI KAISHA TOSHIBA;INTERNATIONAL BUSINESS MACHINES CORP.
发明人
AZUMA, TSUKASA;OHIWA, TOKUHISA;MATSUDA, TETSUO;DOBUZINSKY, DAVID M.;OKUMURA, KATSUYA