| 摘要 |
PROBLEM TO BE SOLVED: To automatically perform a surface flaw removing work by performing grinding on the basis of circumferential directional position information on a flaw specified by a circumferential directional flaw probe and lengthwise directional position and length information on the flaw stored in a storage device. SOLUTION: A flaw probe 10 moves to a lengthwise directional flaw center position by flaw map information stored in a signal processor 15, and a flawed material 8 is chucked by a chucking device 12, and the material is rotated by a material rotating device 13, and a circumferential position of a flaw is probed and specified. Afterwards, the flawed material 8 is fixed by turning a flawed position directly overhead. Afterwards, a grinding tool of an automatic grinder 11 directly connected to the flaw probe 10 descends to the flawed material 8, and removes the flaw while moving in the lengthwise direction. When there are plural flaws, a circumferential directional position is specified every time with every flaw, and the flawed position is turned directly overhead, and grinding work is repeated. |
