| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the generation of chippings and cracks on an insulated substrate by the application of external force, and to prevent the exfoliation of a wiring conductor from the insulated substrate. SOLUTION: The wiring substrate comprises inorganic insulating powder of 60 to 95wt.% and thermosetting resin of 5 to 40wt.%, and the wiring substrate is formed by coating a wiring conductor 2, which is formed by bonding metal powder using thermosetting resin, on the insulated substrate 1 consisting at least of a sheet of insulated substrate which is formed by bonding the above- mentioned inorganic insulating powder by thermosetting resin. In this case, an intermediate layer 5, which is formed by adding a silane coupling agent of 2 to 10 pts.wt. to the thermosetting resin is interposed between the above- mentioned insulated substrate 1 and the wiring conductor 2.</p> |
