发明名称 |
Method of manufacturing multilayer electronic components |
摘要 |
A method of manufacturing a plurality of multilayer electronic components, comprises the steps of: (a) Manufacturing a laminated sheet (1) in which layers of ceramic tape are each provided on one side with a pattern of electrodes; are stacked so that the electrode patterns on consecutive layers are offset back and forth with respect to one another, and are pressed together, cutting the laminated sheet into segments in which consecutive electrodes with a gas cooled laser beam, are alternately exposed at a different segment edge with a gas cooled laser beam; sintering the segments and providing electrical contacts which interconnect the electrodes exposed at given segment edges.
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申请公布号 |
US5758398(A) |
申请公布日期 |
1998.06.02 |
申请号 |
US19960673833 |
申请日期 |
1996.06.27 |
申请人 |
U.S. PHILIPS CORPORATION |
发明人 |
RIJNBEEK, ANTONIUS G.;WARNIER, JACQUES |
分类号 |
B23K26/14;B23K101/36;H01G4/12;H01G4/30;H01G4/38;H01L41/08;H01L41/083;H01L41/09;H01L41/22;H01L41/24;H01L41/273;H01L41/338;(IPC1-7):H01G4/30 |
主分类号 |
B23K26/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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