| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to form a line pattern with good accuracy and with comparatively easy by a method wherein the substantial thickness of copper foils is formed at a prescribed value or lower and at the same time, the surface roughness of the copper foil legs on the surface of a copper foil mat is formed at a prescribed value or lower. SOLUTION: A copper-clad laminated board of a structure, wherein the parts of the copper foils of a single-sided and/or doubled-sided copper-clad laminated board are formed into a thin copper coil by an etching treatment with good accuracy, is used. As the copper-clad laminated board, a copper-clad plastic film, a copper-clad sheet formed by heating and pressing glass woven fabrics or prepregs impregnated with an unwoven fabric base material thermosetting resin and copper foils, a copper-clad laminated board formed by heating and pressing organic fiber woven fabrics, such as polyester fiber woven fabrics and aramide fiber woven fabrics, unwoven fabrics, prepregs impregnated with a thermosetting resin and copper foils, a laminated board formed by bonding copper foils to a thermosetting resin, such as a fluororesin, using glass woven fabrics or unwoven fabric base materials as its reinforcing base materials or the like is used. The thickness of the insulating layers of the copper-clad laminated board is not specially limited. It is suitable that the thickness of the copper foils is 5μm or thinner. It is desirable that the surface of a copper foil mat is formed of a low- profile copper foil.
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