| 摘要 |
PROBLEM TO BE SOLVED: To mount a chip in parallel with the chip mounting surface of a package frame by relatively correcting the slant direction and the slant angle of a semiconductor chip and the chip mounting surface, determining the position so that the right under part of the chip becomes the chip mounting surface, and thereafter lowering the chip vertically with respect to the chip mounting surface. SOLUTION: After a semiconductor chip 1 is carried to the upper part of a chip mounting surface 2a, the slant amount of the chip 1 with respect to the chip mounting surface 2a is measured by a camera 14. Motors 7 and 11 are operated by a control part 15. The slanting direction and the slant angle of stages 4 and 5, which are coupled with shafts 7a and 11a with screws, are corrected. The mounting surface 2a and the chip 1 are made parallel. Thereafter, a motor 13 is driven by the control part 15. The chip 1 is moved in parallel through a moving collet 12. The position is determined so that the right under part of the chip 1 becomes the chip mounting surface 2a. The chip 1 is vertically lowered and die-bonded to the chip mounting surface 2a. Thus, the chip can be mounted always in parallel with respect to the chip mounting surface. |
