发明名称 |
Multi-layer wiring structure having varying-sized cutouts |
摘要 |
An integrated circuit having a multi-layered metal wiring structure with interlayer insulating films therebetween. A small cutout is made in a metal wiring when it is desirous to have the metal wiring touch a contact formed in a through hole passing through said cutout. A larger cutout is made in a metal wiring when it is desirous to have the metal wiring remain spaced from a contact formed in a through hole passing through said cutout.
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申请公布号 |
US5760429(A) |
申请公布日期 |
1998.06.02 |
申请号 |
US19970834303 |
申请日期 |
1997.02.18 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YANO, KOUSAKU;UEDA, TETSUYA |
分类号 |
H01L21/768;H01L23/522;(IPC1-7):H01L23/528 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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