| 摘要 |
PROBLEM TO BE SOLVED: To provide a material suitable for an insulating resin for printed circuit boards that can prevent the occurrence of cracking, when it has no glass cloth structure and uses an acrylic resin material, and has both of the resistance to shock and heat and the reliability in electric insulation, and is excellent in processability such as fine blind bire-holes with an alkali solution. SOLUTION: This resin composition for insulating materials comprises (1) a carboxyl group-bearing alkali-soluble (meth)acrylic polymer and/or methacrylic polymer, (2) one or more C=C unsaturated double bonds-bearing polymerizable compound, (3) fine particles of crosslinked elastic polymer with an average particle size of <=5μm and (4) a polymerization initiator which can initiate the polymerization of the above-stated C=C unsaturated double bonds with heat and/or by irradiation with active rays. |
