| 摘要 |
PROBLEM TO BE SOLVED: To provide formation by which a protective film having a uniform thickness can be formed on an aluminum vapor-deposited film formed over a wide area. SOLUTION: This formation comprises forming a silicone-based protective film 34 on an aluminum vapor-deposited film 32 formed on the surface of each of synthetic resin substrates W. In the formation, each of the substrates W, on which the aluminum vapor-deposited film 32 is formed, is received in a chamber C and plural high frequency induction discharge type plasma sources 40 are arranged in parallel to each other in the chamber C so that each of the plasma sources 40 is directly opposite to one of the substrates W and occupies an area almost equivalent to that occupied by this substrate W. Also, a silicone-based oil vapor is introduced into the chamber C whose inside atmosphere is converted into a plasma state by the plural plasma sources 40, to form the plasma-polymerization product film 34 (silicone-based protective film 34) on the aluminum vapor-deposited film 32 of each of the substrates W. Thus, by arranging plasma sources 40 in parallel to each other, a protective film formation region A is expanded and the plasma protective film 34, i.e., plasma-polymerization product film 34 is formed on the aluminum vapor-deposited film 32 of each of the substrates W placed in the region A. |
