发明名称 PRODUCTION OF ELECTRONIC PART HOUSING CONTAINER
摘要 PROBLEM TO BE SOLVED: To produce an electronic part housing container continuously housing electronic parts such as various mounting parts or precision parts without bending a lead frame. SOLUTION: In a method for producing an electronic part housing container, a mold of a heated thermoplastic resin sheet is utilized to form a recessed hole part and a protruding part molded in a built-up state in order to fix an electronic part and having an edge and provided to the bottom surface of the recessed hole part. In this case, a thermoplastic resin sheet is introduced into the gap between a male mold 11 consisting of a male mold central leg 13 and a male mold peripheral part 12 surrounding the leg 13 to be integrated therewith and a female mold 14 consisting of a fixed female mold central leg 15 and a female mold peripheral part 16 supported by a spring 20 equipped with a plate 19 to be independently moved up and down and, at first, the male mold 11 is allowed to fall to mold the recessed hole part of a housing part and further allowed to fall to hold the bottom surface of the recessed hole part between the male mold central leg 13 and the female mold central leg 15 to mold the protruding part 5 having the edge and, thereafter, a housing container after molding is discharged from the molds by the famale mold peripheral part 16.
申请公布号 JPH10146884(A) 申请公布日期 1998.06.02
申请号 JP19960306404 申请日期 1996.11.18
申请人 SHIN ETSU POLYMER CO LTD 发明人 MIYAUCHI TSUTOMU
分类号 B29C51/08;B29L22/00;B29L31/00;(IPC1-7):B29C51/08 主分类号 B29C51/08
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