发明名称 Composition for oxide CMP
摘要 A chemical mechanical polishing composition comprising carboxylic acid, a salt and a soluble cerium compound at a pH above 3 and a method to selectively polish a silicon oxide overfill in preference to a silicon nitride film layer in a single step during the manufacture of integrated circuits and semiconductors.
申请公布号 US5759917(A) 申请公布日期 1998.06.02
申请号 US19960774488 申请日期 1996.12.30
申请人 CABOT CORPORATION 发明人 GROVER, GAUTAM S.;MUELLER, BRIAN L.
分类号 C09K3/14;C09G;C09G1/02;C23F1/00;H01L21/302;H01L21/304;H01L21/3105;(IPC1-7):C03C25/06 主分类号 C09K3/14
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