| 摘要 |
<p>PROBLEM TO BE SOLVED: To avoid the resonance of inner lead due to the ultrasonic wave oscillation in the case of wire-bonding step. SOLUTION: This lead frame is provided with a die pad 1 for mounting a semiconductor element and a plurality of inner leads 2 arranged around this pad 1 to be connected with a plurality of electrodes of the semiconductor element mounted on the die pad 1 by respective wire-bonding steps. On the plurality of inner leads 2, a tapelike oscillation suppressing member 3 passing through almost central parts of respective inner leads 2 is fitted. The oscillation suppressing member 3 is interposed between a fixing jig 4 for depressing the inner leads 2 downward and the inner leads 2 on a base 5 in the case of the wire-bonding step. Furthermore, the oscillation suppressing member 3 deforms corresponding to the substantial difference in the thickness of respective inner leads 2 due to burrs etc., to be provided with flexibility so that the whole inner leads 2 may be flexibly depressed on the base 5.</p> |
