发明名称 |
Adhesion enhanced semiconductor die for mold compound packaging |
摘要 |
A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound packaging during encapsulation. The increased adhesion reduces delamination potential of the die from the package.
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申请公布号 |
US5760468(A) |
申请公布日期 |
1998.06.02 |
申请号 |
US19960731793 |
申请日期 |
1996.10.18 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
KING, JERROLD L.;BROOKS, J. MIKE;MODEN, WALTER L. |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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