发明名称 |
COPPER WIRE AND PROCESS FOR MAKING COPPER WIRE. |
摘要 |
<p>This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25percent after being annealed at 177 degree C for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.</p> |
申请公布号 |
MX9701017(A) |
申请公布日期 |
1998.05.31 |
申请号 |
MX19970001017 |
申请日期 |
1996.05.30 |
申请人 |
ELECTROCOPPER PRODUCTS LIMITED |
发明人 |
SIDNEY J. CLOUSER;RUDOLF WIECHMANN;BERND SCHNEIDER;ULRIKE BOHMLER;R. DUANE APPERSON;ROBERT J. FEDOR;SHARON K. YOUNG;ROG ROGER N. WRIGHT;STEPHEN J. KOHUT |
分类号 |
C22F1/08;C25D1/04;C25D3/38;C25D5/10;H05K1/00;(IPC1-7):C25D01/04;D02G03/00 |
主分类号 |
C22F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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