发明名称 |
LARGE ARRAY HEATER CHIPS FOR THERMAL. |
摘要 |
An increased resolution thermal ink jet printhead construction and method for forming large array heater chips for thermal ink jet printheads is achieved by fabricating a unitary "megachip" in which multiple cells of electrical components are defined in a plurality of columnar patterns in a plane of a silicon wafer. Cells of a first column are vertically offset from cells of an adjacent column so as to overlap the gap between cells in the first column. The megachip is then formed by grouping at least one cell from each of two adjacent columns and dicing the wafer to remove the megachip.
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申请公布号 |
MX9708937(A) |
申请公布日期 |
1998.05.31 |
申请号 |
MX19970008937 |
申请日期 |
1997.11.19 |
申请人 |
LEXMARK INTERNATIONAL, INC. |
发明人 |
FRANK EDWARD ANDERSON;PAUL ALBERT COOK;ANNA CATHERINE CRAMER |
分类号 |
B41J2/16;G03F7/20;(IPC1-7):B41L27/00 |
主分类号 |
B41J2/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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