Festelektrolytkondensator in Chip-Bauweise

摘要

The invention describes a chip-type solid electrolytic capacitor comprising: an anode body (1) of valve-metal, an anode lead (2) extended from one surface of said anode body, a dielectric layer (3) formed on said anode body, a solid electrolytic layer (4) formed on said dieletric layer, a cathode layer (5) formed on said solid electrolytic layer, an insulating layer (6) formed on said cathode layer so as to cover said one surface of said anode body, a plated layer (7a, 7b) formed on said insulating layer over said one surface, a solder layer (8a, 8b) formed on said plated layer, an alloy layer (9) formed at end portion of said anode lead, said alloy layer consisting of three metals of said anode lead (2), said plated layer (7b) and said solder layer (8b), whereby said plated layer may be a nickel layer and said anode lead may be of tantalum and wherein a distance between the end of said anode lead (2) and said insulating layer (6) along said anode lead may be 0.5 mm or less.