| 摘要 |
<p>A semiconductor chip (2) which is thinner than the substrate (1a) of a tape carrier (1) is placed in a device hole formed in the substrate (1a), and the chip (2) is sealed with a sealing resin (3) so that the front and rear surfaces of the chip (2) can be covered with the resin (3). The position of the chip (2) in the thickness direction of the substrate (1a) is adjusted so that the position can coincide with the stress neutral plane of the entire TCP.</p> |
