发明名称 Housing or circuit board with conductive structure e.g. for computer housing
摘要 The housing for an electrical device or a circuit board (10) is made of an insulating material with an electrically conductive structure (16) applied to its surface via a roller (8.1). The surface of the housing or circuit board may have a raised structure to which the conductive structure is applied via the rolling process in the form of a conductive thick- film ink.
申请公布号 DE19649116(A1) 申请公布日期 1998.05.28
申请号 DE19961049116 申请日期 1996.11.27
申请人 BRAUMANN, GUNDOKAR, 82152 PLANEGG, DE;REICHEL-SEITZ, KARIN, 81377 MUENCHEN, DE 发明人 BRAUMANN, GUNDOKAR, 82152 PLANEGG, DE
分类号 H05K1/00;H05K1/09;H05K3/12;(IPC1-7):H05K3/10;H05K1/02 主分类号 H05K1/00
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