Housing or circuit board with conductive structure e.g. for computer housing
摘要
The housing for an electrical device or a circuit board (10) is made of an insulating material with an electrically conductive structure (16) applied to its surface via a roller (8.1). The surface of the housing or circuit board may have a raised structure to which the conductive structure is applied via the rolling process in the form of a conductive thick- film ink.
申请公布号
DE19649116(A1)
申请公布日期
1998.05.28
申请号
DE19961049116
申请日期
1996.11.27
申请人
BRAUMANN, GUNDOKAR, 82152 PLANEGG, DE;REICHEL-SEITZ, KARIN, 81377 MUENCHEN, DE