Verfahren und Apparat zur Einkapselung einer auf einem Leiterrahmen montierten Halbleitervorrichtung

摘要

A lead frame (40) for receiving a semiconductor device (120) to be encapsulated includes a thor oughfare (300) formed as a solid (non-perforated) part of the strip in which the frame is formed. Apparatus and method for packaging the semiconductor device when secured to the lead frame comprises a mold in which the device and frame are accommodated in the mold. Plastic in fluent form is supplied through a runner (265, 290) to the mold (190) containing the semiconductor devices (120) and the strip (20). The mold (190) forms a cavity (280) about the semiconductor device (120) and the portion of its associated lead frame (40) adjacent to the semiconductor device (120). The plastic is directed over the thoroughfare (300) into the cavities (280) adjacent to the thoroughfare (300).