发明名称 Herstellungssystem für bestückte Leiterplatten und zugehöriges Verfahren
摘要 A system for manufacturing a print board assembly, which is implemented in a system having a computer for storing parts insertion instruction diagrams and displaying parts insertion instructions, and a soldering unit for soldering a printed circuit board, includes: assembling different types of the printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of the printed circuit boards in carriers to assemble them separately according to the parts insertion instructions displayed by the computer of each cell, and moving them to the soldering unit through a transfer conveyor line; and returning the carriers having the printed circuit boards completely soldered to each cell identified for the carriers through a return conveyor line.
申请公布号 DE19752176(A1) 申请公布日期 1998.05.28
申请号 DE1997152176 申请日期 1997.11.25
申请人 SAMSUNG ELECTRONICS CO. LTD., SUWON, KR 发明人 SHIN, EON-MIN, GUMI, KYUNGSANGBUK, KR;LEE, KYU-DONG, GUMI, KYUNGSANGBUK, KR;KIM, TAE-HA, GUMI, KYUNGSANGBUK, KR;KANG, DOO-WON, GUMI, KYUNGSANGBUK, KR;KIM, BUM-SUCK, GUMI, KYUNGSANGBUK, KR;KIM, YANG-KOOG, GUMI, KYUNGSANGBUK, KR;LEE, SEONG-DEOK, GUMI, KYUNGSANGBUK, KR
分类号 B23P19/00;B23P21/00;H01L21/00;H05K3/00;H05K3/34;H05K13/00;(IPC1-7):H05K13/00 主分类号 B23P19/00
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