发明名称 HIGH SPEED AND HIGH DENSITY BACKPLANE CONNECTOR
摘要 <p>The invention comprises an electrical connector assembly (10) for connecting a daughter card (12) to a mother board including a first housing (20) having contacts (34, 38) mounted therein. The contacts are electrically connected to the daughter card (12). An edge housing (24) is mounted along the edge of the daughter card (12). The edge housing has a mating face and a connecting face. The edge housing has contacts (90, 92) mounted therein. The contacts of the edge housing (24) are electrically connected to the contacts in the first housing (20). The mating face has a plurality of contact protrusions (88) forming a field. The contact protrusions have one contact (92) disposed along one side and two contacts (90) disposed along another side to form a differential pair.</p>
申请公布号 WO1998022994(A1) 申请公布日期 1998.05.28
申请号 US1997021396 申请日期 1997.11.19
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