By providing an interconnection structure (1) with strip-shaped elevations (11) which, in a plan view, are preferably asterisk-shaped, the contact face is cleaned during compression and an adhesive can easily flow away. The interconnection structure is very suitable for face-down bonding of drive ICs in a display device. <IMAGE>
申请公布号
DE69128388(T2)
申请公布日期
1998.05.28
申请号
DE1991628388T
申请日期
1991.09.05
申请人
PHILIPS ELECTRONICS N.V., EINDHOVEN, NL
发明人
SCHRAIVOGEL, RAINER ANANDA, NL-5656 AA EINDHOVEN, NL;PLANGGER, GUIDO, NL-5656 AA EINDHOVEN, NL
