An electrical interconnect is described which is a structure comprising a polymer matrix of a microstructure of nodes separated by void spaces and being interconnected by fibrils. The nodes are generally aligned elongated columns and have conductive particles embedded in them. The void spaces may be filled with a nonconductive adhesive.
申请公布号
DE69409827(D1)
申请公布日期
1998.05.28
申请号
DE1994609827
申请日期
1994.06.24
申请人
W.L. GORE & ASSOCIATES, INC., NEWARK, DEL., US
发明人
HANRAHAN, JAMES, R., SPRINGFIELD, PA 19064, US;JOHNSON, DANIEL, D., HOCKESSIN, DE 19707, US