发明名称 |
METHOD OF FORMING RAISED METALLIC CONTACTS ON ELECTRICAL CIRCUITS |
摘要 |
<p>A method is provided for forming at least one raised metallic contact on an electrical circuit. Generally, this method includes the following steps: providing a composite base substrate which is defined by at least a first conductive layer, a dielectric material and a second conductive layer; removing a portion of the first conductive layer to expose the dielectric material; removing the exposed portion of the dielectric material to the second conductive layer, thereby forming a depression; depositing at least one layer of conductive material on at least side wall portions of the depression; removing the second conductive layer; and completely removing the dielectric material to said first conductive layer thereby forming a raised metallic contact which extends perpendicularly away from the first conductive layer.</p> |
申请公布号 |
EP0843955(A1) |
申请公布日期 |
1998.05.27 |
申请号 |
EP19970923639 |
申请日期 |
1997.05.08 |
申请人 |
W.L. GORE &, ASSOCIATES, INC. |
发明人 |
GORRELL, ROBIN, E.;FISHER, PAUL, J. |
分类号 |
H05K3/34;H01L21/60;H05K3/06;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):H05K3/40 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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