| 摘要 |
A bond pad (18, 58) may comprise a base (20, 60) of bondable material. The base (20, 60) may have a periphery (26, 66). A segment of an interconnect (24, 64) may contact an extended section (28, 68) of the periphery (26, 66) to electrically couple the interconnect (24, 64) to the bond pad (18, 58). The interconnect (24, 64) may comprise a material less resistive than the bondable material. <IMAGE> |
