发明名称 |
Electronic multi-level modules assembly |
摘要 |
<p>The multiple layer electronics module Assembly has individual modules (10-21) each having electronic components stacked in height and connected together. There are two slots at right angles between the first and second layer of components. This allows rod spokes to be inserted in the modules, allowing a spaced modular array.</p> |
申请公布号 |
EP0844666(A1) |
申请公布日期 |
1998.05.27 |
申请号 |
EP19970402744 |
申请日期 |
1997.11.17 |
申请人 |
ALCATEL |
发明人 |
DREVON, CLAUDE;BELIN, JEAN-JACQUES |
分类号 |
H01L25/00;H01L23/31;H01L25/065;H01L25/10;(IPC1-7):H01L25/10;H01L25/07 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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