发明名称 |
Semiconductor mounting substrate having micronized wire and method of manufacturing the same |
摘要 |
Without using a photolithography technique, a semiconductor mounting substrate having micronized wirings can be obtained by simple manufacturing steps in a short time. Flaws 2 are formed in a substrate 1, and metalized layers 3 by en electroless plating are formed thereon, whereby micronized wirings are formed. Moreover, the flaws 2 are formed also by laser or a diamond indentation tool to which ultrasonic wave is applied. <IMAGE> |
申请公布号 |
EP0814504(A3) |
申请公布日期 |
1998.05.27 |
申请号 |
EP19970108814 |
申请日期 |
1997.06.02 |
申请人 |
NEC CORPORATION |
发明人 |
SHIBUYA, AKINOBU;KIMURA, MITSURU |
分类号 |
H05K3/00;C23C18/16;C23C18/18;H01L21/48;H05K3/18;H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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