| 摘要 |
<p>Providing a power control device of a simple structure which increases the reliability of a circuit as incorporated therein. A semiconductor component (31) constituting a power control device comprises a semiconductor chip (41), atop of which a cathode (45) and a gate (46) are formed via an oxide film portion (42). The cathode (45) comprises a pad portion (43), a fusion portion (47) and a contact portion (48). The pad portion (43) and the contact portion (48) are interconnected by the fusion portion (43) only. An anode (50) is formed at the bottom of the semiconductor chip (41). With the flow of a fusing current through the fusion portion (47), the fusion portion (47) is fused by heat generated therefrom whereby the current flow through the cathode (45) and the anode (50) is interrupted. <IMAGE></p> |
