| 摘要 |
PROBLEM TO BE SOLVED: To produce a metallic bump which has high hardness and affords a good electrical contact when this bump is used as a contact terminal. SOLUTION: The superfine particles obtd. by evaporating, for example, nickel, are transported together with gaseous helium as a carrier gas and are deposited on a silicon wafer from a nozzle of a microdiameter, by which the conical nickel bump of about 10 to 100μm in diameter of the base and about 24μm height at the aggregate of the superfine particle of several tens nanometer in particle size is formed.
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