| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition that is excellent in resistance to moisture and soldering heat and can guarantee its reliability for a long period of time by using a specific epoxy resin and a specific naphthol resin. SOLUTION: This composition contains (A) an epoxy resin of formula I (B) a naphthol resin of formula II (n is 0 or an integer of >=1), (C) an inorganic filler and (D) a curing accelerator as essential components where the content of the component C is 25-95wt.% based on the whole composition. As the component C, is preferably used a silica powder of reduced impurities having an average particle size of <=30μm. The amount of the component D is preferably 0.01-5wt.% based on the whole resin composition. Since the semiconductor sealer prepared by sealing a semiconductor chip with this resin composition can reduce the influence of moisture absorption, wire disconnection caused by corrosion of the electrode and current leakage caused by moisture can be reduced and the reliability can be expected for a long period of time.
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