发明名称 WIRE FOR WIRE SAW
摘要 PROBLEM TO BE SOLVED: To improve the slice efficiency, and to reduce the slice time by providing a high tensile metallic wire as the stock wire, and carrying abrasive grains made of the material other than the metal such as organic or inorganic material on the surface of the stock wire. SOLUTION: The solution in which the binder 3 consisting of the material other than the metal, e.g. organic material such as polyamide-imide and inorganic material such as glass is melded in the solvent, is mixed, and the abrasive grains 4 are dispersed in the solution. The abrasive dispersed solution is applied to the surface of a stock wire 2 comprising a brass-plated piano wire, and the stock wire 2 is passed through a heating furnace to perform the baking and to manufacture a wire 1 for wire saw. Because the wire 1 for wire saw is of the double abrasive grain system including the abrasive grain 4 on the surface and the abrasive grain in the abrasive grain slurry, the biting performance of the abrasive grain is remarkably improved, and the slice efficiency is improved.
申请公布号 JPH10138114(A) 申请公布日期 1998.05.26
申请号 JP19960311187 申请日期 1996.11.08
申请人 HITACHI CABLE LTD 发明人 OHASHI SEISHIRO;OKADA SHINICHI;ASANO KENJI;SUZUKI KAZUNORI
分类号 B24B27/06;B23D61/18;(IPC1-7):B24B27/06 主分类号 B24B27/06
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